RELIFE RL-403B SOLDER BALLS 0.35mm
Solder balls for motherboard IC chip BGA reballing 25,000 pieces of 0.35mm
Tin melting point of 183°C
Features: Smooth surface and environmentally friendly materials: Composition with trace elements and materials with low environmental impact. Wide range of applications: Ideal for computer motherboard repairs, PCB manufacturing, and chip soldering. Uniform dimensions:Tin balls with uniform diameter, free of defects, and a smooth, shiny surface. High precision and production efficiency: Strictly controlled ball diameter, with an internal tolerance of only 8 micrometers, for consistent quality. Excellent performance in BGA tinning: Melting point of 183°C, suitable for most electronic components. Optimal composition for reliable connections: Essential for connecting semiconductor chips, printed circuit boards, and PCBs, ensuring the effective transmission of electronic signals.
Package Contents: 25,000 x BGA Solder Balls
