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Infrared welding BGA rework station ZM-R380B Reflow & Reball (Laptop Repair Kit, support computer control).
Seamark ZM BGA Rework Station ZM R380B is an excellent rework station for laptop motherboards, desktop computer motherboards, server boards, industrial computer boards, all kinds of game boards, communications equipment motherboards, LCD TVs and other large circuit board BGA rework. The BGA Rework Station ZM R380B has bottom IR heating and the top is hot air heating. The top and bottom heater work independently. A cross-flow fan cools rapidly to protect the PCB from deformation when soldering. The ZM R380B allows you choose imported high-precision materials (temperature sensor, PLC, heater) to control the BGA desoldering & soldering procedures precisely. This machine has a computer communications function, built-in PC serial port, external temperature interface with software to achieve computer control. A high-precision thermocouple is used to achieve the precise temperature detection. The BGA Rework Station ZM R380B Uses a V-groove support equipped with a flexible fixture for PCB positioning to protect the PCB. Large thermal capacity on PCB or other high-temperature and lead-free soldering requirements can all be achieved with the ZM R380B. Main Features: 1.The bottom is IR heater; The top is hot-air heater. 2.Choose imported high-precision materials to control the BGA desoldering & soldering procedures precisely. 3.Has a computer communications function, built-in PC serial port, external temperature interface with software to achieve computer control. 4.High-precision thermocouple to achieve the precise temperature detection. 5.The top and bottom heater work independently. A cross-flow fan cools rapidly to protect the PCB from deformation when welding. 6.Use a V-groove support equipped with a flexible fixture for PCB positioning to protect the PCB. 7.For large thermal capacity of PCB or other hightemperature and lead-free welding requirements,all can be handled easily. 8.With hot-air flow adjust device, to improve the welding effect of BGA. Technical specification : Total Power – 3300W Top heater – 800 W Bottom heater – Infrared plate 2400 W Power supply – AC 220V ± 10% – 50/60Hz Dimensions – 445*430*500mm Positioning – V-groove, PCB support can be adjusted in any direction and with external universal fixture Temperature control – K-type thermocouple (Closed Loop), heating independently, the precision is ±3 degree PCB size – Max 310*300mm Min 20*20 mm Net Weight – 25 kg Technical Parameters Basic Parameters Zones 2 Operations Manual / Software Heating IR Dimension L495mmx W480mmx H420mm Weight 16kg Total weight About 17 kg, vary with the differen need of the users Electrical Parameters Power 220V AC Upper Heating IR Size of Upper heating 80mm x 80mm Consumption of upper heating 450W Bottom Heating IR Size of Bottom heating 2400mm x2000mm Consumption of Bottom heating 1800W General power 2300W Temperature Control Control mode of Upper Independent temperature control, high-precision closed-loop control, precision ± 0.5%, Alarm Control mode of Bottom Independent temperature control, high-precision closed-loop control, precision ± 0.5%, NO Alarm Rework Function SMD Suit for welding, remove or repair packaged devices such as BGA,PBGA,CSP,multi-layer substrates, EMI metallic shield product and solder/lead free Rework welding Size of applicable chips ≤70mm x70 mm Size of applicable PCB ≤400mm x305mm
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