Relife RL-039 is a professional solution designed for removing adhesives used in the assembly of integrated circuits and electronic components. It's specially formulated chemical composition quickly and effectively dissolves adhesive residues without damaging circuits, PCBs or other sensitive components. It is compatible with most materials commonly found in electronics and can be safely used by professionals as well as in repair workshops.
Description :
BGA IC Adhesive removing liquid softens and removes resinating and sealing glue of chip BGA IC of mobile phones.
The ingredients of it is environmental protection and safest. It has good permeability;
it can quickly soften and loosens solidified resin adhesive such as phenolics, epoxy, acrylate, polyurethane, organosilicon.
It does not to harm to circuit board and component, even to maintenance worker.
capacity: 20ml
Specifications: - Chemical composition: special solvents for dissolving IC adhesives - Compatibility: integrated circuits, PCBs, various electronic components - Safety: low toxicity, non-flammable, minimal risk of component damage - Application: liquid, can be applied by brushing, spraying, or soaking - Efficiency: quickly and completely removes adhesives without affecting surfaces or electronic components - Easy to use, with clear handling and safety instructions
Attention: glue removing liquid , it shall not touch skin , eye , close it after using . if touched by accident ,pls use water clean it
How to use :
1. Use a tweezers to pick a piece of cotton wool with bigger size to BGA chip and Dip it into the glue remover.
2. Put the cotton wool on the BGA chip and cover through
3. Place a plastic bag or film on the top and cover the PCB board
4. Wait for 20mins.
5. REDO step 1 to 4
6. Use a tweezers to remove softened sealing glue around the BGA
7. Use Hot air gun (300Deg. C) to heat up the chip. The Glue at the bottom will melt and soften by heat
8. Use a Tweezers / cutter to remove the chip
