MECHANIC QLC-20 2-ML BGA Glue Dissolving Integrated Cell Phone Glue Removing Liquid for Cleaning Circuit Board Motherboard etc...
QLC-20 Glue Removal Chemical Liquid remove different types of resinous adhesives suitable for removing glue from BGA IC chip does not damage BGA IC chip or other components quick softening and removal of glue convenient to use volume: 20 ml